Insulation Foam Board Compound (PLA/PBAT)

About This Product

Insulation Foam Board Compound is a PLA/PBAT foaming grade supplied as a pellet compound for foam board extrusion. It is formulated to hold a fine, even closed-cell structure through a board thickness rather than to expand into loose pellet, which asks for a melt that keeps its strength across the whole expansion. Foam board is used for insulation and for structural packaging panels. In both, the panel's thermal performance and its compressive strength are the specification, and both come out of the same two variables. Thermal conductivity is dominated by the gas held in the closed cells and by how thoroughly the cell walls break up radiation and solid conduction, so a fine cell structure insulates better than a coarse one of the same weight; compressive strength runs the other way and rises with density, so the two are traded against each other rather than maximised together. This grade foams into board in a biodegradable system. Thermal conductivity and compressive strength are confirmed against the board thickness and density produced on your line. Supplied as a raw material for processing on the buyer's own line. We do not produce finished articles. It is used in insulation board, in structural packaging panels and in cold chain packaging. Bio Green Chem supplies Insulation Foam Board Compound to specification on board density and thickness, cell structure, and the thermal conductivity and compressive strength wanted from the panel.