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    Biopolymers & compostable compounds

    Insulation Foam Board Compound (PLA/PBAT)

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    About This Product

    Foam board is used for insulation and for structural packaging panels. In both, the panel's thermal performance and its compressive strength are the specification. This grade foams into board in a biodegradable system. Thermal conductivity and compressive strength are confirmed against the board thickness and density produced on your line. Supplied as a raw material for processing on the buyer's own line. We do not produce finished articles.

    Specifications

    Polymer basePLA/PBAT foaming grade
    FormPellet compound
    ProcessFoam board extrusion
    PropertyThermal insulation
    End of lifeBiodegradable

    Applications

    Insulation boardStructural packaging panelsCold chain packaging
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